![molding compound](https://host.easylife.tw/pics/201709/Amplframe.png)
EMC(EpoxyMoldingCompound)半導體等級封裝環氧樹酯.Definition&Features.Composition:EpoxyResin,Hardner,Filler(Silica),SomeAdditives,Moldcompoundsaretheplasticsusedtoencapsulatemanytypesofelectronicpackages,fromcapacitorsandtransistorstocentralprocess...
Semiconductor Epoxy Mold Compounds
- die attach
- leadframe package
- Stamped lead frame
- flip chip on lead frame
- QFP
- lead frame鍍銀
- lead frame
- leadframe封裝
- qfn
- lead frame substrate
- bga封裝
- lead frame中文
- lead frame封裝
- 導線架封裝
- lead frame導線架
- leadframe process
- leadframe種類
- lead frame導線架
- leadframe製程
- 導線架廠商
- lead frame製程
- leadframe材質
- leadframe package
- lead frame substrate
- lead frame中文
Semiconductormoldingcompoundsarefinefilled,electricallystablecompounds,idealfortheminiaturisedsemiconductorpackagingrequirements.
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